June 2021 Issue
Driving Toward Predictive Analytics with Dynamic Parametric Test
The foundation of parametric test within semiconductor manufacturing is its usefulness in determining that wafers have been fabricated properly. Foundries use parametric test results to help verify that wafers can be delivered to a customer. For IDMs, the test determines whether the wafers can be sent on for sorting. Read More.
SLT Enables Test Content to Shift Right to Optimize Test Efficiency and Part Quality
Increasing device complexity and the continuing drive for higher levels of quality are fostering a reconsideration of test strategies. To be effective, test engineers must choose how to optimally deploy test content, from wafer probing to system-level test (SLT). Read More.
Study Confirms 1.82-mm Coaxial-Interconnect Design Target for mmWave ATE
The adoption of mmWave frequencies for applications such as 5G and WiGig creates new challenges for the ATE industry, including the need for a reliable blind-mate interconnection between the printed-circuit-board (PCB) test fixture and ATE measurement instrumentation. Read More.
Technology is changing our world at an astonishing pace with AI very much in the spotlight. The contrast between potential AI benefits versus possible harmful effects is evident, with many believing the positive from AI will outweigh the negative.
Share your thoughts by taking the GO POLL.
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SPOTLIGHT ON BUSINESS
Q&A Interview with Don Blair
This year marks the 15th anniversary of VOICE, the annual Advantest Developer Conference. Held in past years as two separate in-person events in the U.S. and Asia, VOICE was cancelled in 2020 due to the Covid-19 pandemic. This year, International VOICE will be a single, unified event, held virtually from June 21-23. Don Blair, business development manager for Advantest, brings 30 years of test industry experience to his advisory role on the VOICE 2021 committee. We sat down with him to talk about the upcoming event, its evolution, and what attendees should make sure not to miss. Read More.
Advantest Cloud Solutions™
Today’s semiconductor manufacturers face continual market pressures to design and produce increasingly intricate and complex ICs.
The traditionally used manual approaches for achieving and maintaining high yields are both time-consuming and expensive. As the complexity of chips increases, these traditional methods are becoming cost-prohibitive and less and less suitable for managing the data explosion in semiconductor manufacturing. At the same time, semiconductor manufacturers struggle to realize value from the data they collect. Read More.
Virtual VOICE June 21-23, 2021
Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world’s leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements, express new ideas, share best practices and network with one another. Read More.
Advantest Again Named THE BEST Supplier of Chip Making Equipment in VLSIresearch Customer Satisfaction Survey
Advantest Corporation has again topped the ratings chart of the 2021 VLSIresearch Customer Satisfaction Survey, capturing the No. 1 spot on this annual survey of global semiconductor companies for the second consecutive year. Read More.
ADVANTEST IN THE NEWS
- Presentation Material “Second Mid-Term Management Plan” updated
- Advantest’s Gunma Factory Achieves 100% Renewable Energy Use
- Advantest Opens Registration for International Virtual VOICE 2021 Developer Conference on June 21-23
June 12-23, 2021
Penang, Malaysia, August 23-27, 2021
San Diego, CA, August 30-Sept. 1, 2021
Taipei, Taiwan, September 8-10, 2021
October 10-15, 2021
Munchen, Germany, November 16-19, 2021
San Francisco, CA, December 7-9, 2021
Tokyo, Japan, December 15-17, 2021