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Current Issue of GO SEMI & BEYOND


Improving Debug Time and Test Coverage with Parallel Validation Strategies

Test data volumes are exploding as the number of transistors per chip increases along with the number of test vectors needed to test each transistor. A recent article described how traditional methods of device validation and characterization, ATE structural and functional test, and system-level test no longer suffice due to increased device complexity, and introduced innovations in pre-silicon verification, first silicon bring-up, and post-silicon validation (PSV) that are necessary to meet today’s challenges.  Read More.

Solving High-Energy Testing Challenges

Although the global semiconductor market is currently experiencing a slowdown, the automotive sector remains solid fueled by the demand for EVs. What used to be a niche market is now rapidly expanding to the mainstream, and companies that supply power IC technology must increase production volume to meet growing demand.  Read More.

The Future of Data Analytics and Semiconductor Testing

The world is changing more rapidly than ever. With the explosion of Artificial Intelligence (AI), Machine Learning (ML) and data analytics, semiconductor manufacturers now have the opportunity to extract valuable insights from the massive amounts of data being generated throughout the silicon lifecycle. By leveraging AI algorithms and ML, semiconductor manufacturers can now optimize silicon design, assembly, and testing processes. It is through the analysis of these vast amounts of data, AI can quickly identify patterns, predict failures, and optimize quality.  Read More.


Which automotive applications can benefit most from utilizing chiplets? Share your thoughts by taking the GO POLL. Have an idea for future polls? Email


Q&A Interview with VOICE 2024 Chairperson Linda Haenel

Advantest’s VOICE 2024 Developer Conference will take place June 3-5 at the Hilton La Jolla Torrey Pines in San Diego, California. To learn what VOICE 2024 holds in store for attendees, we interviewed this year’s general chairperson, Linda Haenel, application consultant, Performance Digital Center of Expertise, Advantest Europe. Read More.


Advantest Rolls Out Pin Scale Multilevel Serial – Next-Generation High-Speed ATE Instrument

In November, Advantest announced the Pin Scale Multilevel Serial, its newest high-speed I/O (HSIO) instrument. Designed for use with the V93000 EXA Scale ATE platform, Pin Scale Multilevel Serial is both the first native EXA Scale HSIO instrument and the first fully integrated HSIO ATE instrument to address signaling requirements for advanced communication interfaces.  Read More.

Advantest Targets NAND Flash/NVM Market with New Group of Memory Test Products

In December, Advantest announced three new additions to its suite of memory test products. The new offerings are designed to target NAND Flash and non-volatile memory (NVM) devices, which face extreme pressure to bring down test costs and cost of ownership on the test floor. The new products include the T5230 memory wafer test solution; the STM32G third-generation protocol NAND system-level test module for the T5851 memory tester; and the T5835 high-speed wafer-sort interface option.  Read More.

Advantest Expands Device Handler Offerings

In December, Advantest announced two new products designed to deliver advanced handling capabilities essential for the fast-growing artificial intelligence (AI) and high-performance computing (HPC) markets: the HA1200 die-level handler and the active thermal control (ATC) 2-kilowatt (kW) option for the M487x handler series. Read More.

Advantest Launches Real-Time Data Infrastructure (RTDI™) Platform Driving the Next Generation of Semiconductor Test

At the end of last year, Advantest announced that its newly launched ACS Real-Time Data Infrastructure (RTDI™) has been accepted by multiple major data analytics companies as part of an industry-wide collaboration to accelerate data analytics and artificial intelligence (AI)/machine learning (ML) decision-making within a single, integrated platform. Read More.


Advantest Concludes Successful SEMICON Japan 2023 with Record Attendance

Advantest displayed its latest products and solutions at SEMICON Japan 2023, held on December 13-15 at the Tokyo Big Sight. As a result of Japan’s efforts to bolster its domestic semiconductor industry, this year’s event saw a significant increase in attendance from 50,000 people last year to 85,000 people this year. Read More.


2024-2025 Semiconductor Industry Outlook with TechInsights (Podcast Season 2, Episode 12)

Prepare to be illuminated by the insights of Risto Puhakka from TechInsights as he joins us to map out the semiconductor industry’s explosive growth, driven by the thunderous influence of AI. During our adventure through CES 2024, we bear witness to AI’s pervasive touch, from robotics and healthcare to the sizzling innovations in micro LED technology. Risto’s expert analysis doesn’t just skim the surface; it plunges into the economic, political, and competitive undercurrents that are redefining the semiconductor landscape.  Read More.


Learn more about Advantest’s global ESG activities here.



Shanghai New International Expo Centre
March 20-22, 2024

VOICE 2024
La Jolla, San Diego, CA
June 3-5, 2024



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