As AI accelerates the semiconductor market toward $1 trillion, test content is on the move—shifting both left and right across multiple insertions to optimize quality, time-to-market, and cost of test.
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Wide-bandgap semiconductors like SiC and GaN are reshaping power test. The MTe platform delivers a unified approach to high-voltage, high-frequency device validation.
CPO devices require five distinct test insertions and a modular platform approach. Advantest's split architecture extends seamlessly into the optical domain.
A preview of VOICE 2026 in Scottsdale—new Silicon Photonics track, AI-focused sessions, and keynote speakers from Intel, Amkor, and TechInsights.
Nearly 4,000 visitors saw the M5241 memory test cell, MTe power platform, and a joint ACS/NVIDIA exhibition.
A new digital test card delivering 5 Gbps data rates, expanded vector memory, and concurrent multi-core test for advanced AI and HPC devices.
Stay connected with the semiconductor industry's most important gatherings
Tokyo Big Sight, December 17-19. Nearly 4,000 visitors and a joint ACS/NVIDIA exhibition.
May 18-20, 2026 | The Fairmont Scottsdale Princess, Scottsdale, Arizona
Advantest's commitment to environmental, social, and governance initiatives worldwide
California beach cleanup, German Red Cross blood drive, Singapore student care outreach, and a springtime virtual tour of the Advantest biotope.
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