As AI accelerates the semiconductor market toward $1 trillion, test content is on the move—shifting both left and right across multiple insertions to optimize quality, time-to-market, and cost of test...
As wide-bandgap semiconductors like SiC and GaN displace legacy silicon devices in EVs, renewables, and AI infrastructure, the MTe platform delivers a unified approach to high-voltage, high-frequency ...
As AI server farms drive the shift to optical I/O, CPO devices require five distinct test insertions and a modular platform approach. Advantest's split architecture extends seamlessly into the optical...
VOICE 2026 chairperson Farida Chandran previews this year's developer conference in Scottsdale, Arizona—including a new Silicon Photonics track, AI-focused sessions, and three keynote speakers from In...
A new digital test card for the V93000 EXA Scale platform delivers 5 Gbps data rates, expanded vector memory, and concurrent multi-core test for advanced AI and HPC devices.
SEMICON Japan 2025 drew nearly 4,000 visitors to Advantest's booth, with debuts including the M5241 memory test cell, the MTe power test platform, and a joint ACS/NVIDIA exhibition.
Don Ong interviews Contextual AI CEO Douwe Kiela on grounded, context-aware intelligence for semiconductor test—from fusing wafer maps and test logs to powering lights-out factories.
California beach cleanup, German Red Cross blood drive, Singapore student care outreach, and a springtime virtual tour of the Advantest biotope.
Recent news coverage featuring Advantest's R&D expansion, METI certification, and VOICE 2026 registration.
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