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Advantest Debuts Two New Advantest Cloud Solutions to Boost Production Efficiencies for New IC Designs

Advantest Corporation, working with its partner PDF Solutions Inc., has introduced two new innovative cloud-based software solutions: the ACS Dynamic Parametric Test (DPT) system powered by PDF Exensio® DPT, and an edge high performance compute (HPC) system. These solutions are part of the newly introduced Advantest Cloud Solutions™ (ACS), an ecosystem of cloud-based products and services. At the core of this ecosystem is the data- and analytics-focused platform, Advantest Cloud powered by PDF Exensio, which Advantest is co-developing with PDF Solutions.

Leveraging the core technology developed by PDF Solutions, the data generated from customer workflows is used to provide feedback on processes from semiconductor design validation to manufacturing, chip test, and system-level test. Customers can get more value out of their supply chain, their equipment, and their test data, to achieve faster time-to-yield with higher overall equipment efficiency by using advanced algorithms, integrated workflows, and methodologies delivered through Advantest Cloud Solutions.

Advances in semiconductor technology such as advanced process nodes, electrical scaling, 2.5D, and 3D packaging, and a new focus on systems present unique challenges that can only be solved through comprehensive software-guided solutions. Integrating traditional data silos throughout the semiconductor value chain can significantly improve product quality, manufacturing yield, and cost efficiencies.

The ACS Dynamic Parametric Test system powered by PDF Exensio® DPT, jointly developed by Advantest and PDF Solutions, adds rule-based, intelligent test flow adaptation to the V93000 SMU8 parametric test platform. With this technology, test flows are automatically optimized on-the-fly within milli-seconds to increase die test coverage, improve the characterization of aberrant measurements, correct equipment issues, and streamline the collection of additional data to support root-cause identification and down-stream analytics.

The new ACS edge HPC product can run complex test workloads with millisecond latencies and is available for early adopters. With pre-configured containers for machine learning (ML), demodulation, or other high-performance workloads, the system makes it easy to implement ML in semiconductor test. Besides allowing users to track, manage, and secure all containers from the cloud, it also provides on-demand access to previous insertion data through application programming interfaces (APIs) with built-in forward and backward data feeds. Customers can deploy machine learning models and algorithms in production, perform in-situ test flow optimizations, and remotely manage highly sensitive IP with maximum security.

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Advantest DC Scale XPS256 DPS Card Ramps to Production at Leading Semiconductor Manufacturers

Advantest announced that its DC Scale XPS256 Device Power Supply (DPS) card, developed for use with the V93000 EXA Scale™ SoC test system, is now ramping to production-volume test at leading makers of communications processors. Providing the industry’s first universal DPS pin capability, the XPS256 delivers high accuracy, performance and dynamic response for a variety of data-driven applications.

Key markets such as mobile/broadband communications, high-performance computing (HPC) and artificial intelligence (AI) are driving unprecedented demand for massive data volumes. The XPS256 is designed to meet the associated stringent test-performance requirements, and leverages Advantest’s Xtreme Link™ technology to deliver massive scalability and flexibility.

The XPS256 covers wide-ranging current requirements, implementing unlimited ganging to scale from milliamps (mA) to thousands of Amps with no performance degradation. Combining three instruments in a single power supply, the DPS pin delivers best-in-class flexibility, accuracy (± 150µV) and dynamic response, with full four-quadrant voltage-current (VI) capabilities and very small overshoot/undershoot, enabled by Advantest’s Xtreme Regulation™. 

In addition, the card offers revolutionary probe needle protection and zero-overhead background profiling for current and voltage across the entire test flow; fine-granularity power delivery to ensure current balancing across the needles; and in-line contact-resistance monitoring for adaptive needle cleaning and preventive maintenance. With its ultra-fast hardware clamp, the XPS256 also protects the DUT, probe cards, and sockets against thermal runaways. 

When implemented with the V93000 EXA Scale SoC tester, the XPS256 DPS pin card provides a solution that can deliver high whole-wafer test yields, very fast test times, and reliable and repeatable results for customers entering the exascale computing space.

Advantest has already shipped several hundred DC Scale XPS256 DPS cards to multiple customers. To learn more about the V93000 EXA Scale Generation and DC Scale XPS256 DPS card, visit https://www.advantest.com/products/ic-test-systems/v93000/exa.

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Advantest’s New TS9001 Time Domain Reflectometry (TDR) System Employs Terahertz Technology to Provide High Resolution Analysis of Circuit Faults

Advantest Corporation announced that it has initiated sales of its new TS9001 TDR System. The new system fully utilizes the company’s unique terahertz technology to enable non-destructive and high-resolution analysis on circuit faults in advanced semiconductor packages, such as flip chip BGAs, wafer level packages, and 2.5D/3D ICs. 

The TS9001 TDR System provides semiconductor manufacturers with flexible solutions for addressing a variety of failure analysis requirements. By establishing a low-cost failure analysis environment and enabling connections to high-frequency probing systems already in use by customers. TS9001 offers customers one of the shortest measurement times on the market. 

Advantest’s leading-edge semiconductor test technology and terahertz failure analysis technology supports the development of innovative semiconductor supply chains, while enhancing the customers’ quality control. 

Background

As semiconductor packages (hereafter, devices) grow smaller and more highly integrated, the ability to locate failures with non-destructive, high-resolution technology is increasing in importance. Providing access to the industry’s most advanced failure analysis environment is critical to being able to address the wide variety of failure analysis issues that are present in these complex devices. To meet these requirements, Advantest developed the TS9001 TDR System, which enables customers to direct-connect their high-frequency probing systems, to obtain high-speed, high-resolution measurement. 

Key Features

  • High-speed and high-resolution measurement

The TS9001 TDR system, which utilizes an ultra-short pulse signal processing technology,  achieves higher distance-to-fault resolution of 5 μm and precise fault location identification with the industry’s fastest class measurement time of 30 sec (Number of integration: 1024, 1/10 shorter than our conventional products). This is the same proven technology used in our ground-breaking terahertz analysis systems.

  • Versatile connectivity for high-frequency probing systems

TS9001 can be configured with a high-frequency probing system owned or selected by the customer. It offers flexible solutions according to the device forms or fault analysis environments. 

(1) Failure analysis of devices with micro bump

By connecting the TS9001 to a high-frequency probing system along with a high-resolution microscope, failure analysis of devices with micro bump of minimum diameter 50 μm is possible. 

(2) Temperature control function

Failure analysis of devices kept in low/high temperatures is also possible, if the system is connected to a high-frequency probing system with a thermal-system function.  

(*) TDR (Time Domain Reflectometry) is widely used to locate circuit failures. Input pulsed signals are reflected at circuit faults inside the device. Time domain analysis of the reflected waveform allows users to determine the fault location and failure mode (open or short) by waveform comparison between good device and failed device. The peaks appearing only in the failed device are analyzed to identify them. 

For more information on this system, visit our Website. 

URL: https://www.advantest.com/products/terahertz-spectroscopic-imaging-systems/tdr-option

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New Memory Tester Integrates Burn-In and Core Testing for 5G Product Development

Advantest has added to its H5600 family of memory testers by introducing the new, highly versatile H5620ES engineering test system, designed for both high-speed burn-in and core testing of today’s DDR4, next-generation DDR5, and low-power, double-data-rate (LPDDR) devices in laboratory environments.  By streamlining the number of accessories and reducing the time required between burn-in and core testing, the new H5620ES shrinks the cost of test for evaluating advanced memory devices used throughout 5G applications.  The new system ably addresses all barriers to cost-efficient development and qualification of the newest data-storage ICs that are in high demand for the rapidly growing 5G market.

Like its sister system, the H5620 production unit introduced in March of this year, the new tester delivers high productivity by parallel testing both DDR4 and DDR5 memories. It can accommodate memory ICs with 100-MHz frequencies and 200-Mbps data rates. 

The engineering system is optimized for ease of use in product development, enhancing testing efficiency in the lab prior to production.  Its compact design saves space and enables mobility in laboratory environments while its open-top architecture makes it easy to perform pick-and-place operations without removing the device interface board (DIB).

The H5620ES runs on the same FutureSuite™ operating system as the H5620 production unit, enabling testing with the same waveform.  It also allows pre-testing routines such as contact checking to be conducted on the H5620ES system before transfer to the H5620 tester, thereby reducing cycle times in production.

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Advantest’s New H5620 Tester Performs Both Burn-in and Memory-cell Testing to Address the Rapidly Growing Demand for DDR DRAM Units

Advantest introduced its new versatile, high-throughput H5620 memory tester that combines the capabilities to perform both burn-in and memory-cell testing for advanced DRAMs and LPDDR (low-power, double-data-rate) devices.

With the advent of 5G technology, worldwide DRAM bit-based consumption is expected to approximately double by 2023.  This increase is being driven primarily by growth in the data-processing and mobile-communication market segments, with data centers requiring more memory and smart-phone functionality expanding to include higher resolution, foldable capability and multi-camera designs.  As the average selling prices for memory ICs continue to shrink, semiconductor manufacturers need ways to reduce testing costs while increasing production volumes.

Advantest’s newest tester helps to accomplish this with its superior efficiency.  In production environments, the H5620 can test over 18,000 devices in parallel at 100-MHz frequencies and data rates up to 200 Mbps.  It is adaptable for factory automation and supports a wide temperature range of -10° C to 150° C with a dual-chamber structure featuring individual thermal-control stability.

In addition, the new system can reduce customers’ capital expenditures and save floor space by combining legacy memory-cell testing with the burn-in test process in memory production facilities.

The H5620 runs on the FutureSuite™ operating system with its versatile tool set.  This software ensures that the tester can be easily integrated with legacy memory test systems from Advantest.  In addition, assistance with program coding, debugging, correlation and maintenance is available from Advantest’s global support network.

The new H5620 tester has begun shipping to customers and the H5620ES engineering model will be ready by the second quarter of this calendar year.

H5620 Memory Tester

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Advantest’s New Modules and Test Head Extend the T2000 Platform’s Performance in Evaluating Automotive SoC Devices

Advantest Corporation has expanded the range of its T2000 platform with the launch of two new modules and a test head designed specifically for high-volume testing of devices used in automotive applications.  The new equipment is designed to enhance test coverage, enable higher parallelism and reduce the cost of test for system-on-chip (SoC) devices used in automobiles, a market segment that is projected to have a 9.6 percent compound annual growth rate from 2019 to 2022.

Semiconductor content in automobiles is increasing rapidly as ICs are becoming integral in everything from powertrains and infotainment systems to ADAS (advanced driver-assistance systems) and on-board safety features.   To reach their market potential, automotive SoCs require high-performance, cost-efficient test solutions.

The new RND520 test head has 52 slots, providing the highest pin count available with Advantest’s direct-dock testing option. As a member of the HIFIX (high-fidelity tester access fixture) product line, the new test head supports massively parallel wafer-sort testing.  It covers an area 40 percent larger than its predecessor while using center-clamp technology to ensure stable contact during wafer sorting. In addition, the test head can operate over an extended temperature range up to 175° C.

The enhanced 2GDME digital module leverages 256 channels to test a wide range of SoC devices used in automotive electronics including MCUs, APUs, ASICs and FPGAs operating at speeds up to two gigabits per second (Gbps). It features a dedicated high-performance parametric measurement unit (HPMU) for every 32 I/O channels, giving the unit an expanded current capacity up to 60 milliamperes (mA) for every I/O channel. The module also supports high-voltage applications by enabling electrical stress testing and arbitrary waveform generator (AWG) and digitizer (DGT) functions valuable for characterization purposes.

The new 96-channel DPS192A device power supply facilitates highly parallel testing of automotive SoCs with high pin counts.  This versatile module has a voltage range of -2.0 volts to +9.0 volts and a current range up to 3 amperes. The unit’s capabilities include enhanced slew-rate control as well as a trace function to evaluate power integrity, an averaging function that improves sampling rates for measuring supply currents and a continuous sampling function that enables a new test methodology for IDD spectrum measurement.

The highly flexible T2000 test platform is ideally suited for evaluating SoC devices and other ICs fabricated with small-lot, high-mix manufacturing methods.  The system enables users to respond rapidly to shifting market needs with minimal capital investment while also helping to reduce development times for new designs.

 

DPS192A

RND520

 

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