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December 2019 Issue



Semiconductor Test – Toward a Data-Driven Future

Integrating new and emerging technologies into Advantest’s offerings is vital to ensuring we are on top of future requirements so that we are continually expanding the value we provide to our customers. Industry 4.0 is changing the way we live and work, as well as how we interact with each other and our environment.
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High-Speed I/O Testing with the Power of Two

As the internet backbone speed continues to spiral upwards, the interface speeds to the devices making up the cloud also continue to scale up. As many of these interface, server and artificial intelligence (AI) devices move both to 112Gbps data rates and multi-chip heterogeneous integrations, the industry is facing an increased need for at-speed testing in order to confirm truly known-good devices (KGDs).
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Q&A Interview with Scott West – Expanding SSD Test Capabilities for Extreme Temperatures

Advantest has found great success with its test solutions aimed at the solid-state drive (SSD) market. In this issue of GO SEMI & Beyond, Scott West, Product Marketing Manager for System-Level Test, provides some background on how the company began to address this market, and shares details on its latest SSD offering, the MPT3000ARC, for validation testing to accommodate extreme thermal standards.
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Advantest’s New Modules and Test Head Extend the T2000 Platform’s Performance in Evaluating Automotive SoC Dev

Advantest Corporation has expanded the range of its T2000 platform with the launch of two new modules and a test head designed specifically for high-volume testing of devices used in automotive applications.  The new equipment is designed to enhance test coverage, enable higher parallelism and reduce the cost of test for system-on-chip (SoC) devices used in automobiles, a market segment that is projected to have a 9.6 percent compound annual growth rate from 2019 to 2022.
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Advantest Opens VOICE 2020 Registration and Announces Keynote Speaker for Scottsdale Event

The Advantest VOICE 2020 Developer Conference will return to two popular locations – Scottsdale, Arizona on May 12-13 and Shanghai, China on May 22 – with the tagline “Your Voice. Your Vision. Our Value.” The learning and networking opportunities offered at VOICE through technical sessions, kiosk showcases, keynote speeches, partners’ expositions and social events will expand in 2020 to include a follow-up day of workshops on May 14 in Scottsdale.
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Evaluating a spring probe card solution for 5G WLCSP

With the deployment of the wireless 5G standard and its support for mmWave frequencies that allow gigabits-per-second data rates on the consumer market, the semiconductor industry needs reliable and low-cost test solutions. The 5G standard allows mmWave range frequencies from 24GHz to 28GHz—to frequencies as high as 44GHz, and possibly even higher.
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Seoul, Korea, February 5-7, 2020

Mobile World Congress
Barcelona, Spain, February 24-27, 2020

DATE 2020
Grenoble, France, March 9-13, 2020

Shanghai, China, March 18-20, 2020

Kuala Lumpur, Malaysia, May 12-14, 2020

VOICE Developer Conference
May 12-13, 2020, Scottsdale, AZ
May 14, 2020, Scottsdale, AZ
May 22, 2020, Shanghai, China

European Test Symposium
May 25-29, 2020, Tallinn, Estonia

July 21-23, 2020, San Francisco, CA

Flash Memory Summit
August 4-6, 2020, Santa Clara, CA



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