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March 2019


TDR with Recursive Modeling Optimizes Advanced-Package FA

As the range and volume of chips developed for a host of Internet of Things (IoT) applications continues to escalate, conventional failure analysis (FA) techniques are increasingly challenged by the higher input/output (I/O) density and data throughput associated with complex 2.5D and 3D IC packages.
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Next-Generation Vehicles Pose Automotive Semiconductor Test Challenges

Various market trends are driving requirements for automotive semiconductor test as technology increasingly defines the future of the automobile. According to IHS Markit,1 the total market for semiconductors, having reached nearly $500 billion in 2018, will grow at a CAGR of 4.88% through 2022, while the automotive electronics category, reaching more than $40 billion in 2018, will outpace the total market, growing at a CAGR of 8.74% through 2022.
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This month’s GO POLL wants to know what you think will be a reality by 2056.

Share your thoughts by taking the GO POLL.

Have an idea for future polls? Email


VOICE 2019 Features Comprehensive Technical Program and Exciting Keynoters

For the first time, the Advantest VOICE Developer Conference will be held in Scottsdale, Arizona, on May 14-15, 2019, and in Singapore on May 23. Online registration is available for both venues.  

VOICE 2019 will feature the latest and hottest topics in semiconductor testing, including RF, 5G, 4G, WiFi, MIMO, mmWave and a new technical track dedicated to Advantest’s T2000 platform. The heart of the conference continues to be its comprehensive learning and networking opportunities comprised of a technical program featuring more than 90 presentations; Partners’ Expo; social gatherings; Technology Kiosk Showcase; and innovative keynote speakers.
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Q&A Interview with Leslie Tugman, SEMI’s Vice President of Global Workforce Development and Diversity

As most of us in the electronics manufacturing supply chain are aware, the industry is facing a talent crisis and needs to fill the tech workforce pipeline with employees qualified to perform a plethora of available jobs. In this issue, we talk with Leslie Tugman, SEMI’s Vice President of Global Workforce Development and Diversity, about what SEMI and its member companies, which include Advantest, are doing to address this challenge.
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High-Volume Consumer Devices Need High-Voltage Test Solution

If you’ve been increasingly feeling that your home doesn’t have enough electrical outlets for all of the consumer products you’re amassing, you’re not alone. As our hunger for consumer devices grows, so does our need for more AC-power wall outlets. The common denominator between large entertainment hubs, wearable and portable devices, and smart-home hubs/accessories is the need for AC power – either as a constant source or for on-demand recharging. Hand-in-hand with this requirement comes the need for reliable testing to protect these devices by ensuring their power supplies can handle the associated high voltage.
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Looking to the Next (5th) Generation

The global semiconductor business is constantly on the lookout for the “next big thing”: the mass-market killer app that will drive the next wave of market growth for our industry. While candidates abound – thanks to the continued rise of applications utilizing technologies such as flexible sensors and augmented reality – the new NBT is shaping up to be the next generation of highly efficient 5G mobile networks. Long promised and finally on the cusp of coming to market fruition, 5G will far surpass current 4G LTE technology in both its highs (speed) and lows (latency).
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Please plan to visit or join Advantest at these upcoming events:

Shanghai, China, March 20-22, 2019

DATE 2019
Florence, Italy, March 25-29, 2019

GSA European Executive Forum
Munich, Germany, April 15-16, 2019

VLSI Test Symposium
Monterey, CA, USA, April 23-25, 2019

Kuala Lumpur, Malaysia, May 7-9 2019

VOICE 2019
Scottsdale, AZ, USA, May 14-15, 2019
Singapore, May 23, 2019

GSA Memory+ Conference
Shanghai, China, May 15, 2019

SWTest Conference
Rancho Bernardo, San Diego, CA, USA, June 2-5, 2019

San Francisco, CA, USA, July 9-11, 2019


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